Polishing pad surface condition evaluation method and an...

Details Polishing pad surface condition evaluation method and an... Polishing pad surface condition evaluation method and an...

2006-03-28

2006-03-28

Bali, Vikkram (Department: 2623)

Image analysis

Applications

Surface texture or roughness measuring

C382S143000, C382S145000

Reexamination Certificate

active

07020306

ABSTRACT:
The object of the present invention is to establish a technology for directly evaluating polishing pad surface conditions, to allow high-precision CMP process management, and to improve process throughput. The pad surface is illuminated with light. The intensity of reflected light or fluorescence from the illuminated area or an intensity distribution image is used directly evaluate the pad surface condition. Based on the results of this evaluation, conditioning conditions for a conditioner are optimized, thus allowing high-precision CMP processing while maintaining good pad surface conditions.

REFERENCES:
patent: 5643050 (1997-07-01), Chen
patent: 5708506 (1998-01-01), Birang
patent: 6004196 (1999-12-01), Doan et al.
patent: 6102776 (2000-08-01), Boggs et al.
patent: 2002/0063860 (2002-05-01), Jun et al.
Doi et al, “Semiconductor Planarizing CMP Technology” (6 pages: translation of portion believed to be relevant).

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