Polishing pad of a chemical mechanical polishing apparatus...

Details Polishing pad of a chemical mechanical polishing apparatus... Polishing pad of a chemical mechanical polishing apparatus...

2007-02-15

2010-10-19

Morgan, Eileen P. (Department: 3723)

Abrading

Flexible-member tool, per se

Laminate

C451S526000, C451S527000, C451S529000, C051S293000, C051S298000

Reexamination Certificate

active

07815496

ABSTRACT:
The surface(s) of a polishing pad for polishing an object has a first portion including hydrophilic material and a second portion including hydrophobic material. The first portion of the polishing surface is located in a first region of the polishing pad and the second portion of the polishing surface is located in a second region of the polishing pad juxtaposed with the first region in the radial direction of the pad. The hydrophilic material may be a polymer resin that contains hydrophilic functional groups having OH and/or ═O at bonding sites of the polymer. The hydrophobic material may be a polymer resin that contains hydrophobic functional groups having H and/or F at bonding sites of the polymer. The polishing pad is manufactured by extruding respective lines of the hydrophilic and hydrophobic materials. The extruders and a backing are moved relative to each other such that the lines form concentric rings of the hydrophilic and hydrophobic materials.

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patent: WO 2005/099962 (2005-10-01), None

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