Polishing pad having a wear level indicator and system using the

Details Polishing pad having a wear level indicator and system using the Polishing pad having a wear level indicator and system using the

1998-05-08

2000-08-22

Dawson, Robert

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

438691, 451259, C23F 102

Patent

active

061066613

ABSTRACT:
A polishing pad having a wear level indicator and a polishing system employing the same is provided. A polishing pad, in accordance with one embodiment of the invention, includes a pad structure and an indicator, disposed in the pad structure, indicating the wear level of the pad structure. The pad structure may, for example, include a top pad and a bottom pad with the indicator being disposed in the top pad. The wear level may, for example, be a critical thickness of the polishing pad which indicates the end of the pad lifetime or which indicates the need to change polishing processing. The use of a wear level indicator allows for efficient and reliable pad wear level indication.

REFERENCES:
patent: 5913713 (1999-06-01), Cheek et al.

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