Polishing pad for use in chemical/mechanical planarization...

Details Polishing pad for use in chemical/mechanical planarization... Polishing pad for use in chemical/mechanical planarization...

2005-09-20

2005-09-20

Hail, III, Joseph J. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S037000, C451S056000, C451S058000, C451S526000, C051S298000

Reexamination Certificate

active

06945846

ABSTRACT:
A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, or may be created by removing a complete vertical section of the pad. The injected polymer forms an integral window with the pad by flowing into the matrix of the pad at the pad/window interface. No additional reinforcement is required to hold the window in place; however, adhesive and/or another impervious layer may be attached behind the window for additional support. In an alternative embodiment, a separate and distinct window-plug is inserted into a cutout section of the pad, and bonded to the pad by one or more binding film layers on the back, non-working surface of the pad.

REFERENCES:
patent: 5304223 (1994-04-01), Pieper et al.
patent: 5435816 (1995-07-01), Spurgeon et al.
patent: 6022264 (2000-02-01), Cook et al.
patent: 6299516 (2001-10-01), Tolles
patent: 6300247 (2001-10-01), Prabhu

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