Polishing pad for chemical-mechanical polishing of a semiconduct

Details Polishing pad for chemical-mechanical polishing of a semiconduct Polishing pad for chemical-mechanical polishing of a semiconduct

1993-12-16

1995-08-15

Breneman, R. Bruce

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

H01L 21461

Patent

active

054415985

ABSTRACT:
A mold is used to form a polishing pad, wherein the surface of the polishing side of the polishing pad is determined by a primary surface of the mold. Features along the polishing side of a polishing pad may take any one of several different shapes. Channels along the polishing side of the polishing pad allow a smaller pore size to be used. The mold allows more control over the surface of the polishing side, which in turn give more control over polishing characteristics.

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