Abrading – Abrading process – With tool treating or forming
Reexamination Certificate
2005-11-29
2005-11-29
Morgan, Eileen P. (Department: 3723)
Abrading
Abrading process
With tool treating or forming
C451S010000, C451S011000, C451S036000, C451S443000, C451S446000
Reexamination Certificate
active
06969307
ABSTRACT:
A pad conditioning system for conditioning a polishing pad in conjunction with polishing of a workpiece includes a pad conditioning head coupled with a positioning unit. The pad conditioning head includes a conditioning surface that is configured to be moved into contact with a polishing pad to condition the polishing pad. The pad conditioning system also includes a polishing liquid supply port disposed in the conditioning surface. The polishing liquid supply port is configured to selectively discharge polishing liquid during the conditioning operation. The discharged polishing liquid is worked into the polishing pad by the pad conditioning head during the conditioning operation. A workpiece, such as a semiconductor wafer, that is also moved into contact with the polishing pad is polished using the discharged polishing liquid.
REFERENCES:
patent: 5782675 (1998-07-01), Southwick
patent: 5857899 (1999-01-01), Volodarsky et al.
patent: 5913714 (1999-06-01), Volodarsky et al.
patent: 6053801 (2000-04-01), Pinson et al.
patent: 6086460 (2000-07-01), Labunsky et al.
patent: 6190236 (2001-02-01), Drill
patent: 6200207 (2001-03-01), Hsu
patent: 6241587 (2001-06-01), Drill et al.
patent: 6283840 (2001-09-01), Huey
patent: 6306019 (2001-10-01), Finkelman
patent: 6306022 (2001-10-01), Tung et al.
patent: 6328637 (2001-12-01), Labunsky et al.
patent: 6336845 (2002-01-01), Engdahl et al.
patent: 6361414 (2002-03-01), Ravkin et al.
patent: 6371838 (2002-04-01), Holzapfel
patent: 6390902 (2002-05-01), Chang et al.
patent: 6530827 (2003-03-01), Mitsuhashi
patent: 6554688 (2003-04-01), Lacy
patent: 6626743 (2003-09-01), Boyd
patent: 6645046 (2003-11-01), Vogtmann et al.
patent: 6648740 (2003-11-01), Perlov et al.
patent: 6695684 (2004-02-01), Park et al.
patent: 6740169 (2004-05-01), Cho et al.
patent: 6752697 (2004-06-01), Stoeckgen et al.
patent: 6773332 (2004-08-01), Moore
Brinks Hofer Gilson & Lione
Lam Research Corporation
Morgan Eileen P.
LandOfFree
Polishing pad conditioning and polishing liquid dispersal... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polishing pad conditioning and polishing liquid dispersal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing pad conditioning and polishing liquid dispersal... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3480704