Polishing pad and method of manufacture

Details Polishing pad and method of manufacture Polishing pad and method of manufacture

2005-03-22

2005-03-22

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S526000, C451S548000

Reexamination Certificate

active

06869339

ABSTRACT:
A method of joining sections of polishing pad for use in the chemical mechanical planarization of a semiconductor wafer. Two sections of polishing pad are positioned so that they contact one another. The two sections are then welded together to create a robust joint. The joint is resistant to infiltration of slurry and is not susceptible to delamination that commonly occurs in a typical laminate joint.

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Patent Abstracts of Japan; Publication No. 09109033; publication date Apr. 28, 1997; application date Oct. 12, 1995; application No. 07289195.

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