Polishing pad, a polishing apparatus, and a process for...

Details Polishing pad, a polishing apparatus, and a process for... Polishing pad, a polishing apparatus, and a process for...

2007-02-20

2007-02-20

Wilson, Lee D. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S041000, C451S008000, C451S285000

Reexamination Certificate

active

11390292

ABSTRACT:
A polishing pad can include a first layer and a second layer. The first layer can have a first polishing surface and a first opening. The second layer can have an attaching surface and a second opening substantially contiguous with the first opening. The polishing pad can further include a pad window lying within the first opening. The pad window can include a second polishing surface and a gas-permeable material. In one aspect, an apparatus can include an attaching surface of a platen lying adjacent to the attaching surface of the polishing pad. In another aspect, a process for polishing can include changing a temperature of a gas within a spaced-apart region formed between a pad and a platen. The process can also include forming a gas flux across the polishing pad after polishing has started.

REFERENCES:
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5461007 (1995-10-01), Kobayashi
patent: 5691253 (1997-11-01), Kobayashi
patent: 6146248 (2000-11-01), Jairath et al.
patent: 6254459 (2001-07-01), Bajaj et al.
patent: 6280289 (2001-08-01), Wiswesser et al.
patent: 6280290 (2001-08-01), Birang et al.
patent: 6323046 (2001-11-01), Agarwal
patent: 6454630 (2002-09-01), Tolles
patent: 6599765 (2003-07-01), Boyd et al.
U.S. Appl. No. 11/221,376, filed Sep. 6, 2005, entitled “Platen Endpoint Window with Pressure Relief,” by Bottema.

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