Polishing methods and apparatus

Details Polishing methods and apparatus Polishing methods and apparatus

2007-04-10

2007-04-10

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

Controlling temperature

C451S288000, C451S053000

Reexamination Certificate

active

11273134

ABSTRACT:
Apparatus for and methods of chemical mechanical polishing (CMP) of semiconductor wafers are disclosed. A preferred embodiment comprises an apparatus for polishing a semiconductor workpiece that includes a polishing pad, a fluid dispenser adapted to dispense a fluid to the polishing pad, and a temperature measurement device adapted to measure the temperature of the fluid. The apparatus includes a heat exchanger adapted to increase or decrease the temperature of the fluid.

REFERENCES:
patent: 4450652 (1984-05-01), Walsh
patent: 5127196 (1992-07-01), Morimoto et al.
patent: 5775980 (1998-07-01), Sasaki et al.
patent: 5957750 (1999-09-01), Brunelli
patent: 5972792 (1999-10-01), Hudson
patent: 6020262 (2000-02-01), Wise et al.
patent: 6095898 (2000-08-01), Hennhöfer et al.
patent: 6150271 (2000-11-01), Easter et al.
patent: 6299514 (2001-10-01), Boller
patent: 6315635 (2001-11-01), Lin
patent: 6561381 (2003-05-01), Osterheld et al.
patent: 6834777 (2004-12-01), Osterheld et al.
patent: 6953750 (2005-10-01), Wu et al.
patent: 6976902 (2005-12-01), Koo et al.
patent: 2001/0055940 (2001-12-01), Swanson
patent: 2002/0039874 (2002-04-01), Hecker et al.
Nishimoto, A., et al., “An In-situ Sensor for Reduced Consumable Usage Through Control of CMP,” NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing, 16 pp. MIT Microsystems Technology Laboratories, Cambridge, MA.
Nishimoto, A., et al., “An In-situ Sensor for Reduced Consumable Usage Through Control of CMP,” Extended Abstracts, SRC TechCon '98, Sep. 1998, 4 pages, Semiconductor Research Corporation, Las Vegas, NV.
Sorooshian, J., et al., “Arrhenius Characterization of ILD and Copper CMP Processes,” Journal of the Electrochemical Society, 2004, vol. 151, Issue 2, pp. G85-G88, The Electrochemical Society, Inc., Pennington, NJ.

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