Polishing method and polishing system

Details Polishing method and polishing system Polishing method and polishing system

2007-02-06

2007-02-06

Rose, Robert A. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S006000

Reexamination Certificate

active

11231755

ABSTRACT:
A polishing method includes supplying a slurry onto a pad disposed above a turntable while rotating the turntable, and polishing a workpiece disposed on the pad by pressing the workpiece to the pad, and detecting an ion concentration of a specific ion included in the slurry on the pad by using an ion test paper during the polishing.

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patent: 6071818 (2000-06-01), Chisholm et al.
patent: 2005/0226767 (2005-10-01), Klocke
patent: 04-232283 (1992-08-01), None
patent: 2000-225558 (2000-08-01), None
Fukushima, et al., “Method of Manufacturing Semiconductor Device”, U.S. Appl. No. 11/051,624, filed Jan. 27, 2005.

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