Polishing method and polishing device

Details Polishing method and polishing device Polishing method and polishing device

2007-07-30

2009-11-24

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

Utilizing fluent abradant

C451S037000, C451S044000, C451S059000, C451S060000, C451S299000, C451S303000, C451S307000

Reexamination Certificate

active

07621799

ABSTRACT:
Disclosed herein is a polishing method for polishing the end surface of a wafer by using a polishing tape, wherein the end surface of the wafer is polished in the condition where a polishing liquid containing an oxidizing agent is supplied to the end surface of the wafer.

REFERENCES:
patent: 6558239 (2003-05-01), Kunisawa et al.
patent: 6699299 (2004-03-01), Sachan et al.
patent: 7195545 (2007-03-01), Nakayama et al.
patent: 7367873 (2008-05-01), Ishii et al.
patent: 2004/0106363 (2004-06-01), Ishii et al.
patent: 2005/0148290 (2005-07-01), De Rege Thesauro et al.
patent: 2005/0159085 (2005-07-01), Scott
patent: 2008/0057832 (2008-03-01), Schroeder et al.
patent: 2001-044148 (2001-02-01), None
patent: 2001-345294 (2001-12-01), None
patent: 2003-163188 (2003-06-01), None
patent: 2003-209075 (2003-07-01), None
patent: 2003-234314 (2003-08-01), None
patent: 2003-273045 (2003-09-01), None
patent: 2004-103825 (2004-04-01), None
patent: 2006-066891 (2006-03-01), None
patent: 2007-317702 (2007-12-01), None
patent: 2008-041781 (2008-02-01), None
patent: WO01/33620 (2001-05-01), None
patent: 2005-081301 (2005-09-01), None
Japanese Office Action dated May 8, 2008 for U.S. Appl. No. 2006-215213.
Japanese Office Action dated Aug. 5, 2008 for Application No. 2006-215213.

Affiliated with

Also associated with

Rating

Polishing method and polishing device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing method and polishing device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing method and polishing device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4141347