Polishing method and polishing apparatus

Details Polishing method and polishing apparatus Polishing method and polishing apparatus

1997-11-26

2000-01-11

Eley, Timothy V.

Abrading

Abrading process

Utilizing fluent abradant

451 41, 451 6, 451 7, 451488, B24B 100

Patent

active

060129670

ABSTRACT:
A rotatable platen has a polishing pad adhered to the top surface thereof. A carrier for holding a substrate and a slurry supply pipe for supplying an abrasive slurry onto the near-center region of the polishing pad are provided above the polishing pad. Two lamps for partially irradiating the surface of the polishing pad with visible light or infrared light are provided at respective locations above the polishing pad and upstream of the carrier in the direction of rotation of the platen. Of the area of the polishing pad in contact with the substrate, a region closer to the center of rotation of the polishing pad and a region farther away therefrom are heated by the two lamps.

REFERENCES:
patent: 4450652 (1984-05-01), Walsh
patent: 4471579 (1984-09-01), Bovensiepen
patent: 5643050 (1997-07-01), Chen
patent: 5643060 (1997-07-01), Sandhu et al.
patent: 5722875 (1998-03-01), Iwashita et al.
patent: 5769697 (1998-06-01), Nishio
patent: 5851846 (1998-12-01), Matsui et al.

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