Polishing method and electropolishing apparatus

Electrolysis: processes – compositions used therein – and methods – Electrolytic erosion of a workpiece for shape or surface... – With control responsive to sensed condition

Reexamination Certificate

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C205S647000

Reexamination Certificate

active

10694263

ABSTRACT:
A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.

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patent: 6066030 (2000-05-01), Uzoh
patent: 6234870 (2001-05-01), Uzoh et al.
patent: 6315883 (2001-11-01), Mayer
patent: 2003/0062269 (2003-04-01), Sharan

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