Polishing method and apparatus for automatic reduction of wafer

Details Polishing method and apparatus for automatic reduction of wafer Polishing method and apparatus for automatic reduction of wafer

1995-04-17

1997-04-15

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With indicating

451288, B24B 722

Patent

active

056203578

ABSTRACT:
A polishing method and apparatus for reducing wafer taper in single-wafer polishing are disclosed, by which the whole processes from measurement of thickness profile of wafers and polishing thereof are fully automated and the working efficiency is not only improved, but also the polished wafers are produced with high accuracy in reduction of the taper thereof.
The present invention is executed as follows: Thickness profiles of a wafer is measured with a measurement instrument of thickness in X,Y direction mutually perpendicular, and the taper T and stock removal S.sub.0 are determined from the thickness profiles with the method of least squares by a CPU and further the eccentricity .delta., which is the distance between the center of the wafer and that of pressing force, is determined with the help of an equation

REFERENCES:
patent: 4742651 (1988-05-01), Wittstock
patent: 5486129 (1996-01-01), Sandhu et al.

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