Polishing method and apparatus

Details Polishing method and apparatus Polishing method and apparatus

2006-09-05

2006-09-05

Eley, Timothy V. (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

With indicating

C156S345120, C216S038000, C216S088000, C438S692000, C451S041000, C451S054000, C451S067000, C451S288000, C451S290000, C451S339000

Reexamination Certificate

active

07101259

ABSTRACT:
A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.

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