Polishing method

Details Polishing method Polishing method

1995-04-13

1997-03-11

Kisliuk, Bruce M.

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 8, B24B 4900, B24B 5100

Patent

active

056095112

ABSTRACT:
Disclosed is a method of polishing a thin film layer to be polished, which is formed on the surface of a substrate, by pressing the substrate on the surface of a polishing pad and relatively moving the substrate and the polishing pad, the method comprising the steps of: detecting the position of a front surface of the thin film layer to be polished using a first sensor and also detecting the position of a bottom surface of the thin film layer using a second sensor, on the way of the polishing; calculating the residual thickness of the thin film layer on the basis of the detected positions of the front and bottom surfaces of the thin film layer; and controlling the processing condition of the subsequent polishing on the basis of the calculated residual thickness of the thin film layer.

REFERENCES:
patent: 3148129 (1964-09-01), Basseches et al.
patent: 3515987 (1970-06-01), Zurbrick et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5081421 (1992-01-01), Miller et al.
patent: 5099614 (1992-03-01), Arai et al.
patent: 5234868 (1993-08-01), Cote
patent: 5245794 (1993-09-01), Salugsugan

Affiliated with

Also associated with

Rating

Polishing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-438841