Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2006-03-01
2010-06-22
Eley, Timothy V (Department: 3724)
Abrading
Abrading process
Glass or stone abrading
C451S059000, C451S060000, C451S063000, C451S072000, C451S289000, C451S398000, C451S443000
Reexamination Certificate
active
07740521
ABSTRACT:
The present invention provides a polishing head1comprising a carrier3, a guide ring4, a dress ring5, and a head body2, wherein the head body2is rotatable, and holds the carrier3, the guide ring4, and the dress ring5; the head body2has a reversed-bowl shape and has a hollow8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism9communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad11on a turn table12with rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.
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Ariga Yasuharu
Hashimoto Hiromasa
Kitagawa Kouzi
Kubota Toshimasa
Masumura Hisashi
Eley Timothy V
Oliff & Berridg,e PLC
Shin-Etsu-Handotai Co., Ltd.
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