Polishing head, polishing apparatus and polishing method for...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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Details

C451S059000, C451S060000, C451S063000, C451S072000, C451S289000, C451S398000, C451S443000

Reexamination Certificate

active

07740521

ABSTRACT:
The present invention provides a polishing head1comprising a carrier3, a guide ring4, a dress ring5, and a head body2, wherein the head body2is rotatable, and holds the carrier3, the guide ring4, and the dress ring5; the head body2has a reversed-bowl shape and has a hollow8; the dress ring, and at least the guide ring or the carrier are held by being coupled to a lower brim of the head body via a diaphragm6; the hollow of the head body is sealed. During polishing, the pressure of the sealed hollow is adjusted with a pressure regulating mechanism9communicating with the hollow, thereby elastically deforming the diaphragm. As a result, a wafer W can be polished while the wafer and the dress ring are pressed with a given pressing force against a polishing pad11on a turn table12with rotating the wafer held by the carrier and the dress ring. Consequently, there is provided a polishing head or the like with which excessive polishing in the outer periphery of a semiconductor wafer can be prevented and generation of impressions or scratches in the edge portion of the wafer can be prevented effectively.

REFERENCES:
patent: 5857899 (1999-01-01), Volodarsky et al.
patent: 6196905 (2001-03-01), Inaba
patent: 6203414 (2001-03-01), Numoto et al.
patent: 6309290 (2001-10-01), Wang et al.
patent: 6398906 (2002-06-01), Kobayashi et al.
patent: 6758939 (2004-07-01), Marquardt et al.
patent: 6890249 (2005-05-01), Zuniga et al.
patent: 2004/0092217 (2004-05-01), Marquardt
patent: 1 582 293 (2005-10-01), None
patent: A 11-333711 (1999-12-01), None
patent: B2 3045966 (2000-03-01), None
patent: A 2000-190203 (2000-07-01), None
patent: B2 3158934 (2001-02-01), None
patent: A 2001-079757 (2001-03-01), None
patent: A 2003-220549 (2003-08-01), None

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