Abrading – Machine – Rotary tool
Reexamination Certificate
2005-09-20
2005-09-20
Wilson, Lee D. (Department: 3723)
Abrading
Machine
Rotary tool
C451S289000, C451S398000, C340S384200
Reexamination Certificate
active
06945861
ABSTRACT:
A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.
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Boo Jae-Phil
Kim Jong-Soo
Lee Sang-Seon
Lee Sun-Wung
Ryu Jun-Gyu
Mills & Onello LLP
Ojini Anthony
Samsung Electronics Co,. Ltd.
Wilson Lee D.
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