Polishing head of chemical mechanical polishing apparatus...

Abrading – Machine – Rotary tool

Reexamination Certificate

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Details

C451S041000, C451S289000, C451S398000

Reexamination Certificate

active

06881135

ABSTRACT:
A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the carrier and the supporter, and means for moving the chucking ring up and down in a vertical direction. The supporter forms a sealed space together with the membrane, and the chucking ring chucks the wafer in vacuum.

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patent: 6361420 (2002-03-01), Zuniga et al.
patent: 6447379 (2002-09-01), Gromko et al.

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