Polishing fluids and methods for CMP

Details Polishing fluids and methods for CMP Polishing fluids and methods for CMP

2008-09-03

2011-12-06

Deo, Duy (Department: 1713)

Abrasive tool making process, material, or composition

With inorganic material

C051S309000, C438S690000, C438S691000, C438S692000, C438S693000

Reexamination Certificate

active

08070843

ABSTRACT:
Provided are several polishing compositions useful for modifying a surface, such as a semiconductor wafer suitable for fabrication of a semiconductor device, especially when used in fixed abrasive planarization techniques. The polishing compositions include a synergistic mixture of water, an oxidizing agent, a complexing agent, and metal ions. Also provided are various methods of surface planarization.

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