Polishing compound for chemimechanical polishing and...

Details Polishing compound for chemimechanical polishing and... Polishing compound for chemimechanical polishing and...

2007-06-19

2007-06-19

Norton, Nadine (Department: 1765)

Compositions

Etching or brightening compositions

C252S079200, C252S079400, C438S692000

Reexamination Certificate

active

10069404

ABSTRACT:
This invention provides a polishing medium for CMP, comprising an oxidizing agent, a metal-oxide-dissolving agent, a protective-film-forming agent, a water-soluble polymer, and water, and a polishing method making use of this polishing medium. Also, it is preferable that the water-soluble polymer has a weight-average molecular weight of 500 or more and the polishing medium has a coefficient of kinetic friction of 0.25 or more, a Ubbelode's viscosity of from 0.95 mPa·s (0.95 cP) to 1.5 mPa·s (1.5 cP) and a point-of-inflection pressure of 5 kPa (50 gf/cm2).

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