Polishing carrier head with a modified pressure profile

Details Polishing carrier head with a modified pressure profile Polishing carrier head with a modified pressure profile

2006-07-11

2006-07-11

Morgan, Eileen P. (Department: 3723)

Abrading

Machine

Rotary tool

C451S288000, C451S398000

Reexamination Certificate

active

07074118

ABSTRACT:
A polishing carrier head including a retaining ring for defining an area of a polishing pocket region used to polish a predetermined object, is provided. The polishing carrier head may further include a perforated plate positioned lateral to the retaining ring, the perforated plate having a plurality of perforations for permitting fluid flow. The polishing carrier head may further include a flexible membrane having a first region overlying a portion of the retaining ring and the perforated plate and a second region in which a first portion of the flexible membrane overlies a second portion of the flexible membrane to form one or more bellows. The polishing carrier head may further include an edge support ring in contact with the first region of the flexible membrane for clamping the first region of the flexible membrane to the perforated plate.

REFERENCES:
patent: 6132298 (2000-10-01), Zuniga et al.
patent: 6227955 (2001-05-01), Custer et al.
patent: 6244942 (2001-06-01), Zuniga
patent: 6890249 (2005-05-01), Zuniga et al.
patent: 6984168 (2006-01-01), Melvin et al.
patent: 2004/0029503 (2004-02-01), Kajiwara et al.
patent: 2004/0266324 (2004-12-01), Bottema et al.
patent: 2005/0142995 (2005-06-01), Perlov et al.
patent: 2005/0215182 (2005-09-01), Fuhriman et al.

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