Polishing apparatus, semiconductor device manufacturing...

Abrading – Work holder – Work rotating

Reexamination Certificate

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Details

C451S398000, C451S494000, C438S692000, C438S693000, C051S302000, C051S302000

Reexamination Certificate

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06857950

ABSTRACT:
The present invention provides a polishing apparatus with a construction which makes it possible to prevent the peripheral portions of a substrate from sloping downward as a result of the polishing member tilting at the peripheral portions of the substrate during the polishing of the substrate, and which makes it possible to adjust the contact pressure quickly in accordance with changes in the contact area between the polishing surface and the substrate surface.

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patent: 2000-6004 (2000-01-01), None

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