Polishing apparatus and method with direct load platen

Details Polishing apparatus and method with direct load platen Polishing apparatus and method with direct load platen

2007-04-03

2007-04-03

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With feeding of tool or work holder

C451S286000

Reexamination Certificate

active

11241254

ABSTRACT:
A method and apparatus for chemical mechanical polishing includes a platen supports a polishing article, a robot located proximate the platen, a carrier head having a retaining ring, and a carrier heads support mechanism. The robot is configured to position a substrate on the polishing article, and the carrier heads support mechanism is configured to move the carrier head into a position that the retaining ring surrounds the substrate.

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patent: 2002/0179251 (2002-12-01), Zuniga

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