Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2006-02-14
2006-02-14
Nguyen, George (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S057000, C451S059000, C451S066000, C451S067000
Reexamination Certificate
active
06997782
ABSTRACT:
A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.
REFERENCES:
patent: 4050954 (1977-09-01), Basi
patent: 4680893 (1987-07-01), Cronkhite et al.
patent: 4836733 (1989-06-01), Hertel et al.
patent: 4838150 (1989-06-01), Suzuki et al.
patent: 5096477 (1992-03-01), Shinoda et al.
patent: 5131799 (1992-07-01), Nishi et al.
patent: 5278494 (1994-01-01), Obigane
patent: 5299584 (1994-04-01), Miyazaki et al.
patent: 5329732 (1994-07-01), Karlsrud et al.
patent: 5333413 (1994-08-01), Hashimoto
patent: 5354995 (1994-10-01), Endo et al.
patent: 5425793 (1995-06-01), Mori et al.
patent: 5431600 (1995-07-01), Murata et al.
patent: 5566076 (1996-10-01), Kuroda
patent: 5567927 (1996-10-01), Kahn et al.
patent: 5568821 (1996-10-01), Ohmori et al.
patent: 5655954 (1997-08-01), Oishi et al.
patent: 5679059 (1997-10-01), Nishi et al.
patent: 5679060 (1997-10-01), Leonard et al.
patent: 5779520 (1998-07-01), Hayakawa
patent: 5885138 (1999-03-01), Okumura
patent: 6500051 (2002-12-01), Nishi et al.
patent: 60-8189 (1985-03-01), None
patent: 63-207559 (1988-08-01), None
patent: 6-252110 (1994-09-01), None
Request for Information, 3, 1.
Ebara CMP, 58, 2.
Quotation 1, 98 (92sheets), 3.
Quotation 2, 9, 4.
Purchase Order, 4, 5.
Letter, 3 (original and translation), 6.
Experiment Summary, 4, 7.
Declaration of M. Hirose, 6 (original and translation), 8.
Declaration of N. Kimura, 13 (original and translation), 9.
Declaration of M. Tsujimura, 12 (original and translation), 10.
Declaration of N. Yago, 4 (original and translation), 11.
Acceptance Test Report Jun. 20, 1994, 23, 12.
EPM test result, 2, 13.
IBM Technology Products B/650 ASTC Request for Information, 16, 14.
Supplemental Declaration of N. Kimura, 4 (original and translation, 15.
Supplemental Declaration of N. Yago, 3 (original and translation), 16.
William C. O'Mara, “Planarization by Chemical-Mechanical Polishing for Multilevel Metal Integrated Circuits”, O'Mara & Associates, 1994, pp. 62-64 and 37.
Aoki Riichiro
Himukai Kazuaki
Imoto Yukio
Kodama Shoichi
Kouno Gisuke
Nguyen George
Wenderoth , Lind & Ponack, L.L.P.
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