Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1998-04-08
2000-06-20
Utech, Benjamin L.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C23F 102
Patent
active
060773855
ABSTRACT:
A polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring for holding a workpiece and pressing the workpiece against the polishing cloth under a first pressing force to polish the workpiece. The top ring has a recess defined therein for accommodating the workpiece therein. A presser ring is vertically movably disposed around the top ring, and is pressed against the polishing cloth under a variable second pressing force. The first and second pressing forces are variable independently of each other, and the second pressing force is determined based on the first pressing force. Relative rotation between the top ring and the presser ring is achieved during polishing.
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U.S. application No. 08/728,069, filed Oct. 9, 1996, Masamichi Nakashiba et al., entitled "Apparatus For and Method of Polisihing Workpiece".
U.S. application No. 08/728,070, filed Oct. 9, 1996, Norio Kimura et al., entitled "Apparatus For and Method of Polishing Workpiece".
Kimura Norio
Yasuda Hozumi
Anderson Matthew
Ebara Corporation
Utech Benjamin L.
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