Polishing apparatus

Details Polishing apparatus Polishing apparatus

1998-12-11

2000-03-28

Scherbel, David A.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 45, 451 59, 451 63, 454187, 454195, B24B 4900

Patent

active

060424559

ABSTRACT:
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes an enclosing structure having an outer wall and at least one door, a polishing section enclosed by the enclosing structure for polishing a surface of a workpiece by holding the workpiece and pressing the workpiece against a polishing surface of a turntable, a sensor for detecting an opening or closing of the door, and an exhaust system for exhausting ambient air from an interior of the enclosing structure. The polishing apparatus further includes an adjusting mechanism for adjusting an amount of air which is exhausted from the interior of the enclosing structure. The amount of air exhausted from the interior of the enclosing structure is reduced by the adjusting mechanism when the door is closed, and the amount of air exhausted from the interior of the enclosing structure is increased by the adjusting mechanism when the door is opened.

REFERENCES:
patent: 5653623 (1997-08-01), Kimura et al.
patent: 5655954 (1997-08-01), Oishi et al.
patent: 5664995 (1997-09-01), O'Keefe
patent: 5679059 (1997-10-01), Nishi et al.

Affiliated with

Also associated with

Rating

Polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1321298