Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate
2005-10-31
2011-12-27
Morgan, Eileen P. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
With indicating
C451S010000, C451S011000, C451S285000, C451S287000
Reexamination Certificate
active
08083571
ABSTRACT:
A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical, direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
REFERENCES:
patent: 5584751 (1996-12-01), Kobayashi et al.
patent: 5762539 (1998-06-01), Nakashiba et al.
patent: 5795215 (1998-08-01), Guthrie et al.
patent: 5803799 (1998-09-01), Volodarsky et al.
patent: 5916016 (1999-06-01), Bothra
patent: 5964653 (1999-10-01), Perlov et al.
patent: 5975994 (1999-11-01), Sandhu et al.
patent: 6027398 (2000-02-01), Numoto et al.
patent: 6056632 (2000-05-01), Mitchel et al.
patent: 6068549 (2000-05-01), Jackson
patent: 6077385 (2000-06-01), Kimura et al.
patent: 6080040 (2000-06-01), Appel et al.
patent: 6106378 (2000-08-01), Perlov et al.
patent: 6113468 (2000-09-01), Natalicio
patent: 6210255 (2001-04-01), Zuniga et al.
patent: 6220930 (2001-04-01), Lin et al.
patent: 6231428 (2001-05-01), Maloney et al.
patent: 6241585 (2001-06-01), White
patent: 6257953 (2001-07-01), Gitis et al.
patent: 6354928 (2002-03-01), Crevasse et al.
patent: 6431953 (2002-08-01), Carter et al.
patent: 6494765 (2002-12-01), Gitis et al.
patent: 6705930 (2004-03-01), Boyd et al.
patent: 6857945 (2005-02-01), Chen et al.
patent: 7326103 (2008-02-01), Sakurai et al.
patent: 2002/0086624 (2002-07-01), Zuniga et al.
patent: 2004/0121704 (2004-06-01), Sakurai et al.
patent: 2004/0180610 (2004-09-01), Togawa
patent: 2004/0192168 (2004-09-01), Faustmann et al.
patent: 2006/0193992 (2006-08-01), Bonkass et al.
patent: 1 034 887 (2000-09-01), None
patent: 1 092 505 (2001-04-01), None
patent: 1 177 859 (2002-02-01), None
patent: 2 338 439 (1999-12-01), None
patent: 5-277929 (1993-10-01), None
patent: 2000-317825 (2000-11-01), None
patent: 2001-179605 (2001-07-01), None
patent: 2003-071712 (2003-03-01), None
patent: 2004-154874 (2004-06-01), None
patent: 99/07516 (1999-02-01), None
patent: 2004/041479 (2004-05-01), None
Supplementary European Search Report dated Feb. 11, 2011 in corresponding European Patent Application No. 05800303.9.
Fukushima Makoto
Nabeya Osamu
Togawa Tetsuji
Ebara Corporation
Morgan Eileen P.
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4293773