Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate
2006-02-14
2006-02-14
Ackun, Jr., Jacob K. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
With indicating
C451S285000
Reexamination Certificate
active
06997778
ABSTRACT:
A polishing apparatus comprises a polishing tool, a substrate holding member, and a sensor for detecting a failure of a substrate to be polished.
REFERENCES:
patent: 3137587 (1964-06-01), Wieder
patent: 5447890 (1995-09-01), Kato et al.
patent: 5733171 (1998-03-01), Allen et al.
patent: 5823853 (1998-10-01), Bartels et al.
patent: 5838447 (1998-11-01), Hiyama et al.
patent: 5872633 (1999-02-01), Holzapfel et al.
patent: 5897424 (1999-04-01), Evans et al.
patent: 5916015 (1999-06-01), Natalicio
patent: 5948205 (1999-09-01), Kodera et al.
patent: 6076256 (2000-06-01), Drake et al.
patent: 6241578 (2001-06-01), Togawa et al.
patent: 6273792 (2001-08-01), Meloni
patent: 6293846 (2001-09-01), Oguri
patent: 6328629 (2001-12-01), Togawa et al.
patent: 6386947 (2002-05-01), Donohue
patent: 6416402 (2002-07-01), Moore
patent: 6424137 (2002-07-01), Sampson
Egawa Tadanori
Kojima Yasuhisa
Kurita Masato
Oguri Shozo
Ono Koji
Ackun Jr. Jacob K.
Ebara Corporation
Kabushiki Kaisha Toshiba
Wenderoth , Lind & Ponack, L.L.P.
LandOfFree
Polishing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Polishing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Polishing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3640380