Polishing apparatus

Details Polishing apparatus Polishing apparatus

2005-05-31

2005-05-31

Nguyen, George (Department: 3723)

Abrading

Abrading process

Combined abrading

C451S041000, C451S398000, C451S286000, C438S645000, C438S633000

Reexamination Certificate

active

06899603

ABSTRACT:
In a polishing apparatus having a cover body with fluid pressing mechanism, during polishing, vibration and migration of sticking portion between a retainer and a membrane generated in downstream of rotation of a polishing platen is prevented by reducing sticking force between the retainer and the membrane to less than force needed to wafer polishing with rotation of the cover body.

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