Polishing apparatus

Details Polishing apparatus Polishing apparatus

2005-01-18

2005-01-18

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S010000, C451S011000, C451S041000, C451S307000

Reexamination Certificate

active

06843706

ABSTRACT:
A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing apparatus comprises a polishing table for making rotary or circulatory motion, a top ring vertically movably disposed above the polishing table for removably holding a workpiece to be polished, a pair of rolls rotatable about their own axes and movable in unison with the polishing table, and a polishing pad which is wound on one of the rolls and supplied over an upper surface of the polishing table toward the other of the rolls.

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patent: 1025955 (2000-08-01), None
patent: 9845090 (1998-10-01), None

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