Polishing agent and polishing method

Details Polishing agent and polishing method Polishing agent and polishing method

1995-09-21

1998-06-30

Warden, Jill

Cleaning and liquid contact with solids

Processes

Using solid work treating agents

134 28, 134 29, B08B 700

Patent

active

057727805

ABSTRACT:
An organic insulating film is polished utilizing a polishing agent containing cerium oxide particles (a ceria slurry). The ceria slurry is composed of cerium oxide powder containing a total concentration of Na, Ca, Fe, and Cr of less than 10 ppm. Fragile inorganic and organic insulating films formed at relatively low temperatures can be polished without degrading characteristics of a semiconductor element having such films thereon, due to, e.g., Na diffusion.

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