Platinum alloy electrodeposition bath and process for manufactur

Details Platinum alloy electrodeposition bath and process for manufactur Platinum alloy electrodeposition bath and process for manufactur

1993-09-24

1995-06-06

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

205255, C25D 256

Patent

active

054219914

ABSTRACT:
This invention provides a platinum alloy electrodeposition bath which, by alloying platinum with other metals, enables thick plating and can give platinum alloy layers having superior luster and hardness, and also provides a process for manufacturing a platinum alloy electrodeposited product using the same.
The platinum alloy electrodeposition bath according to this invention contains 2 to 100 g/lit. of platinum in the form of Pt(OH).sub.6.sup.2- complex ion and at least one of Sn, Zn and Pd in an amount of 1 mg/lit or more.

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Indira et al, "Addition Agent For Platinum Plating", Metal Finishing, May 1969, pp. 44-49.
Lowenheim F. A., "Electroplating", McGraw-Hill Co., New York, 1978, pp. 426-441.
Baumgartner, M. E. and Raub, Ch.J., "The Electrodeposition of Platinum and Platinum Alloys", Platinum Metals Rev., 32(4), pp. 188-197 (1988).
Angus, H. C., "Ontwikkelingen bij het elektrolytisch neerslaan van metalen uit de platinagroep", International Nickel Ltd., London, pp. 74-78.
Baumgartner, M. E. et al., "Elektrolytisch adgeschiedene Platin-Kobalt-Legierungsschichten (Mechanische und magnetische Eigenschaften)", Metalloberflache, 41, pp. 559-563 (1987).

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