Plating uniformity control by contact ring shaping

Details Plating uniformity control by contact ring shaping Plating uniformity control by contact ring shaping

2006-04-11

2006-04-11

Bell, Bruce F. (Department: 1746)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S297080, C204S297090, C204S297100, C204S199000, C204S213000, C204S22400M, C029S825000, C029S874000, C029S729000, C029S745000

Reexamination Certificate

active

07025862

ABSTRACT:
An apparatus for providing an electrical bias to a substrate in a processing system is described. The apparatus generally includes a conductive annular body defining a central opening. The conductive annular body may have a substrate seating surface adapted to receive the substrate and a plurality of scallops formed on a surface opposing the substrate seating surface. A plurality of electrical contacts may be formed on the substrate seating surface opposite the plurality of scallops. The electrical contacts may be adapted to engage a plating surface of the substrate.

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