Plating tail design for IC packages

Details Plating tail design for IC packages Plating tail design for IC packages

2005-06-21

2005-06-21

Potter, Roy (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S667000

Reexamination Certificate

active

06908855

ABSTRACT:
A plating tail connected to a signal trace for use during an electroplating operation is fabricated such that it has a substantially different impedance from the signal trace at a characteristic frequency in use, so that adverse reflections during operation are reduced below a threshold of significance.

REFERENCES:
patent: 4581301 (1986-04-01), Michaelson
patent: 6740971 (2004-05-01), Brooks et al.

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