Plating solutions for electroless deposition of copper

Details Plating solutions for electroless deposition of copper Plating solutions for electroless deposition of copper

2007-11-20

2007-11-20

Klemanski, Helene (Department: 1755)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001260

Reexamination Certificate

active

11427266

ABSTRACT:
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical brightener component, a halide component, and a pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.

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