Plating solution for electroless deposition of copper

Details Plating solution for electroless deposition of copper Plating solution for electroless deposition of copper

2007-12-11

2007-12-11

Klemanski, Helene (Department: 1755)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001260

Reexamination Certificate

active

11382906

ABSTRACT:
An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a triamine based complexing agent, and an acidic pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.

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A. Vaskelis, E. Norkus, J. Jaciauskiene, “Kinetics of Electroless Copper Deposition Using Cobalt(II)- Ethylenediamine Complex Compounds as Reducing Agents”,Department of Chemical Kinetics and Catalysis, Institute of Chemistry2002 pp. 297-303, no month.
A. Vaskelis, E. Norkus, A. Jagminiene, L. Tamasauskaite-Tamasiunaite, “Electroless Silver Plating at Elevated Temperature Using Cobalt(II)- Ammonia Complex Compounds as Reducing Agents”,Institute of Chemistry, 1998 pp. 105-108, no month available.
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