Plating-rinse-plating process for fabricating copper...

Details Plating-rinse-plating process for fabricating copper... Plating-rinse-plating process for fabricating copper...

2007-04-03

2007-04-03

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating electrolytic or nonelectrolytic coating after it is...

C205S157000, C205S123000, C205S182000

Reexamination Certificate

active

10325773

ABSTRACT:
An improved copper ECD process. After the copper seed layer (116) is formed, a first portion of copper film (118) is plated onto the surface of the seed layer (116). The surface of the first portion of the copper film (118) is then rinsed to equalize the organic adsorption on all sites to prevent preferential copper growth in dense areas. After rinsing, the remaining copper of the copper film (118) is electrochemically deposited.

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patent: 2003/0141194 (2003-07-01), Chen
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patent: 2004/0040857 (2004-03-01), Chen et al.
patent: 2004/0092065 (2004-05-01), Chen et al.

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