Plating compositions and processes

Details Plating compositions and processes Plating compositions and processes

1991-02-19

1992-12-08

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

205250, 205267, 106118, 427437, 4274431, C25D 348, C25D 362, C23C 1606

Patent

active

051695146

ABSTRACT:
A gold or gold alloy plating composition comprises: a source of gold ions such as potassium gold (I) cyanide; optionally a source of alloying metal (e.g. nickel or cobalt) ions, for example as a sulphate; optionally a complexing agent for the alloying metal ions if present, such as citic acid or oxalic acid; and a rate promoting additive compound of general formula IA or IB: ##STR1## wherein: each of R.sup.1 and R.sup.2 independently represents a hydrogen or halogen atom or a formyl, carbamoyl, C.sub.1-4 alkyl, amino, phenyl or benzyl group, wherein the alkyl, phenyl and benzyl moieties may optionally be substituted with one or more hydroxy or amino groups or halogen atoms;

REFERENCES:
patent: 3929595 (1975-12-01), Biberbach et al.
patent: 5024736 (1991-06-01), Clauss et al.
patent: 5049286 (1991-09-01), Tremmel

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