Plating a conductive material on a dielectric material

Details Plating a conductive material on a dielectric material Plating a conductive material on a dielectric material

2005-03-15

2005-03-15

Lebentritt, Michael (Department: 2824)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Including dielectric isolation means

C257S520000, C257S538000

Reexamination Certificate

active

06867473

ABSTRACT:
A surface may be selectively coated with a polymer using an induced surface grafting or polymerization reaction. The reaction proceeds in those regions that are polymerizable and not in other regions. Thus, a semiconductor structure having organic regions and metal regions exposed, for example, may have the organic polymers formed selectively on the organic regions and not on the unpolymerizable or metal regions.

REFERENCES:
patent: 5428500 (1995-06-01), Nishiyama et al.
patent: 6185354 (2001-02-01), Kronz et al.
patent: 6232042 (2001-05-01), Dunn et al.
patent: 6429115 (2002-08-01), Tsai et al.
patent: 6451074 (2002-09-01), Bluvstein et al.
patent: 6704190 (2004-03-01), Honda et al.

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