Platen with diaphragm and method for optimizing wafer polishing

Details Platen with diaphragm and method for optimizing wafer polishing Platen with diaphragm and method for optimizing wafer polishing

2006-03-28

2006-03-28

Rachuba, M (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S330000

Reexamination Certificate

active

07018273

ABSTRACT:
A platen is provided for use in a chemical mechanical planarization (CMP) system. The platen is provided with diaphragms that overcome a fluid-conservation problem experienced in prior air-bearing platens. The diaphragms enable a removal profile to be manipulated by configuring one or more diaphragms to control localized polishing pressure while capturing free-flowing fluid that is input to the apparatus. The diaphragms also minimize loss of normally-free-flowing fluid from a fluid-bearing.

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