Platen structure of polishing apparatus for processing...

Details Platen structure of polishing apparatus for processing... Platen structure of polishing apparatus for processing...

2007-01-02

2007-01-02

Morgan, Eileen P. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S285000, C451S287000, C451S494000

Reexamination Certificate

active

11260902

ABSTRACT:
A platen structure of a polishing apparatus for semiconductor wafer and a method for exchanging a polishing pad affixed to the same are provided in which the polishing pad supported by the platen is exchanged with convenience within a short time. The platen structure of the polishing apparatus in which the polishing pad attached to the platen of the polishing apparatus comprises a pad plate to which the polishing pad for polishing a wafer is attached, and a platen body combined with the pad plate and having at least one vacuum hole formed thereto to provide a vacuum passage.

REFERENCES:
patent: 5660581 (1997-08-01), Shin et al.
patent: 5704827 (1998-01-01), Nishi et al.
patent: 5921852 (1999-07-01), Kimura et al.
patent: 6244941 (2001-06-01), Bowman et al.
patent: 6379221 (2002-04-01), Kennedy et al.
patent: 6520895 (2003-02-01), Senga et al.
patent: 6602380 (2003-08-01), Doan et al.
patent: 6663470 (2003-12-01), Doan et al.
patent: 7001251 (2006-02-01), Doan et al.
patent: 2003/0114079 (2003-06-01), Berkstresser et al.
patent: 405191036 (1993-07-01), None

Affiliated with

Also associated with

Rating

Platen structure of polishing apparatus for processing... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Platen structure of polishing apparatus for processing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Platen structure of polishing apparatus for processing... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3731279