Plated structures or components

Details Plated structures or components Plated structures or components

2007-10-30

2007-10-30

Zimmerman, John J (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Defined configuration of both thickness and nonthickness...

C428S600000, C428S596000, C428S598000, C428S935000, C205S075000, C205S118000

Reexamination Certificate

active

11014357

ABSTRACT:
Various structures or components can include plated surfaces or other parts. For example, an article can include a base and a plated part with a limit artifact that results from plating adjacent a non-plateable surface; the limit artifact can be disposed away from the base. Exemplary limit artifacts include lack of protrusions, smooth upper surfaces, and curved surfaces, where a curved surface can transition between a smooth upper surface and an irregular side surface. Exemplary plated structures can be tube-shaped or cup-shaped, with an opening at a top end and, around the opening, a lip with a limit artifact. Wall-like structures can similarly have limit artifacts at their top end. If plating on a mold's side surface, the non-plateable surface can be the lower surface of an overhanging polymer disk or structure positioned on the mold. Plated tubes and wall-like structures can be employed in microfluidic structures.

REFERENCES:
patent: 2246380 (1941-06-01), Norris
patent: 3376210 (1968-04-01), Buske et al
patent: 4675083 (1987-06-01), Bearss et al.
patent: 4954225 (1990-09-01), Bakewell
patent: 6334856 (2002-01-01), Allen et al.
patent: 6458231 (2002-10-01), Wapner et al.
patent: 6528350 (2003-03-01), Fork
patent: 6616966 (2003-09-01), Mathieu et al.
patent: 6644791 (2003-11-01), Andrews
patent: 6663820 (2003-12-01), Arias et al.
patent: 6800849 (2004-10-01), Staats
patent: 7118389 (2006-10-01), Fork et al.
patent: 2002/0019133 (2002-02-01), Toya et al.
patent: 2003/0208167 (2003-11-01), Prausnitz et al.
patent: 2005/0282411 (2005-12-01), Fork et al.
patent: 2006/0070226 (2006-04-01), Daniel et al.
patent: 2006/0087064 (2006-04-01), Daniel et al.
patent: 2006/0132531 (2006-06-01), Fitch et al.
Moreno, J.D, Marcos, M.L., Agullo-Rueda, F., Guerrero-Lemus, R., Martin-Palma, R.J., Martinez-Duart, J.M., and Gonzales-Velasco, J., “A galvanostatic study of the electrodeposoition of polypyrrole into porous silicon,” Thin Solid Films, 348 (1999), pp. 152-156.
Jakob, C., Erler, F., Nutsch, R., Steinhauser, S., Wielage, B., Zschunke, A., 15th Interfinish 2000 of the IUSF, Garmisch-Partenkirchen, Germany, Sep. 13-15, 2000, pp. 1-11.
Shah, K., Iroh, J.O., “Adhesion of Electrochemically Formed Conducting Polymer Coatings on Al-,” Surface Engineering, vol. 20, No. 1, Feb. 1, 2004, pp. 53-58, abstracted at www.ingenta.com/isis/searching/ExpandTOC/ingenta?issue=pubinfobike://maney/se/2004/00000020/00000001&index?11, abstract printed May 20, 2004.
Riley, G., “Stud Bumping 300 mm Wafers,” published at the Web site www.flipchips.com/update14.html (2 pages), printed Jul. 7, 2004.
Description of electrodeposition of calcareous deposits at the Stanford University Web site www.stanford.edu/˜erlee/seament/seament.htm (4 pages), printed Nov. 11, 2004.

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