Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Reexamination Certificate
2007-10-09
2007-10-09
Dexter, Clark F. (Department: 3724)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having specified scribe region structure
C438S464000, C125S023010, C125S035000, C225S096500, C225S104000
Reexamination Certificate
active
10869930
ABSTRACT:
Disclosed herein is a dividing apparatus for dividing a plate-like workpiece, which is put on the top surface of a protective tape affixed to an annular frame and which has reduced strength along dividing lines. The apparatus includes a frame holder for holding the annular frame, a tape expander for expanding the protective tape, a detector for detecting the plate-like workpiece, a divider for pressing dividing lines to divide the workpiece into chips along the lines detected by the detector, a device for pushing up divided chips through the protective tape, and a device for picking up pushed up chips.
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Austrian Patent Office Search Report via IPOS for Singapore patent application 200403801-4.
Austrian Patent Office Examination Report via IPOS for Singapore patent application 200403801-4.
Kobayashi Satoshi
Nagai Yusuke
Dexter Clark F.
Disco Corporation
Smith , Gambrell & Russell, LLP
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