Plate-like workpiece dividing apparatus

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure

Reexamination Certificate

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Details

C438S464000, C125S023010, C125S035000, C225S096500, C225S104000

Reexamination Certificate

active

10869930

ABSTRACT:
Disclosed herein is a dividing apparatus for dividing a plate-like workpiece, which is put on the top surface of a protective tape affixed to an annular frame and which has reduced strength along dividing lines. The apparatus includes a frame holder for holding the annular frame, a tape expander for expanding the protective tape, a detector for detecting the plate-like workpiece, a divider for pressing dividing lines to divide the workpiece into chips along the lines detected by the detector, a device for pushing up divided chips through the protective tape, and a device for picking up pushed up chips.

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patent: 6726526 (2004-04-01), Sekiya et al.
patent: 2002-192367 (2002-07-01), None
patent: 2002-334852 (2002-11-01), None
Austrian Patent Office Search Report via IPOS for Singapore patent application 200403801-4.
Austrian Patent Office Examination Report via IPOS for Singapore patent application 200403801-4.

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