Plastic solder array using injection molded solder

Details Plastic solder array using injection molded solder Plastic solder array using injection molded solder

1998-04-27

2000-02-29

Ryan, Patrick

Metal fusion bonding

Process

Preplacing solid filler

228 563, 228253, 22818022, 228 41, 228245, 228246, H05K 334

Patent

active

060298820

ABSTRACT:
Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.

REFERENCES:
patent: 4585157 (1986-04-01), Belcher
patent: 4979664 (1990-12-01), Lyons et al.
patent: 5244143 (1993-09-01), Ference et al.
patent: 5547894 (1996-08-01), Mandelman et al.
patent: 5551148 (1996-09-01), Kazui et al.
patent: 5673846 (1997-10-01), Gruber
patent: 5718361 (1998-02-01), Braun et al.
patent: 5718367 (1998-02-01), Covell, II et al.

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