Plastic packaging for a surface mounted integrated circuit

Details Plastic packaging for a surface mounted integrated circuit Plastic packaging for a surface mounted integrated circuit

1996-12-19

1998-07-07

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257666, 257738, 257787, 257613, 257123, 257124, H01L 2348, H01L 23495, H01L 2328

Patent

active

057773823

ABSTRACT:
In accordance with the invention, integrated circuit dies may be packaged in a plastic package employing an area area array technology such as a conductive ball grid array, column grid array or pin grid array. One aspect of the invention is an integrated circuit package(10) which includes an electronic circuit enclosed by a plastic body (12, 14). The molded plastic body has a first major surface opposing a second major surface. The first major surface of integrated circuit (10) has a plurality of openings therein. One of a plurality of conductive pads (18) is adjacent to each one of the openings and is electrically connected to the electronic circuit. Each of a plurality of conductors (20) is electrically connected to one of the pads (18) and protrudes from one of the openings (22).

REFERENCES:
patent: 5293072 (1994-03-01), Tsuji et al.

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