Plastic-packaged semiconductor device having lead support and al

Details Plastic-packaged semiconductor device having lead support and al Plastic-packaged semiconductor device having lead support and al

1990-11-27

1991-09-24

Jackson, Jr., Jerome

357 74, 357 70, 357 80, H01L 2348, H01L 2328, H01L 2302, H01L 3902

Patent

active

050518135

ABSTRACT:
A plastic-packaged semiconductor device, method of making same, and mounting same to a printed circuit board is disclosed. The device has a body, and a plurality of leads extending from the body. Plastic webs are formed between adjacent leads for supporting the leads. Plastic bumps are formed at the ends of the webs, and align with recesses between conductors of wiring patterns on printed circuit boards, aiding in alignment of the device with the board.

REFERENCES:
patent: 3716764 (1973-11-01), Birchler et al.
patent: 4043027 (1977-04-01), Birchler et al.
patent: 4794446 (1988-12-01), Hamano
patent: 4870476 (1989-07-01), Solstad
Microelectronics Packaging Handbook, Tummala and Rymaszewki, Van Nostrand Reinhold, 1988, pp. 578-591.

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