Plastic package with lead frame crossunder

Details Plastic package with lead frame crossunder Plastic package with lead frame crossunder

1983-10-21

1986-06-17

James, Andrew J.

357 80, 357 72, 357 68, H01L 2348, H01L 2310

Patent

active

045959455

ABSTRACT:
Proposed is a new way to distribute power off chip using a specially designed lead frame. The support paddle of the lead frame is split electrically and provides at least two conductor members that are arranged to cross under the chip after the chip is bonded to the paddle. Power and/or ground can be distributed to two or more edges of the chip by providing bonding sites at or near the extremities of the crossunders. The chip itself is electrically isolated from the crossunder members.

REFERENCES:
patent: 3374537 (1968-03-01), Doelp, Jr.
patent: 3480836 (1969-11-01), Aronstein
patent: 3942245 (1976-03-01), Jackson et al.
patent: 3967296 (1976-06-01), Intrator
patent: 4454529 (1984-06-01), Philofsky et al.

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