Plastic package with exposed die

Details Plastic package with exposed die Plastic package with exposed die

1997-02-11

1999-04-13

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257694, 257713, 257684, 257735, 361714, 361718, H01L 2302

Patent

active

058941088

ABSTRACT:
A molded plastic package incorporates a lead frame which includes a plurality of leads radially aligned around a central opening. A die is mounted in the central opening and is electrically connected to the leads by wire bonding. A molded plastic casing is formed over the die, wiring and lead frame to encapsulate the package. The lower surfaces of the die and lead frame are exposed through the package. A method for making the molded plastic package includes mounting the die and lead frame onto an adhesive tape, electrically connecting the die to the leads by wire bonding, forming a molded plastic casing over the die, wire bonding and lead frame, and then removing the adhesive tape to expose the lower surfaces of the die and the lead frame.

REFERENCES:
patent: 5157480 (1992-10-01), McShane et al.
patent: 5177669 (1993-01-01), Juskey et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5273938 (1993-12-01), Lin et al.
patent: 5276351 (1994-01-01), Yamazaki et al.
patent: 5296738 (1994-03-01), Freyman et al.
patent: 5450283 (1995-09-01), Lin et al.
patent: 5483098 (1996-01-01), Joiner, Jr.
patent: 5604376 (1997-02-01), Hamburgen et al.

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